Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate
2007-03-20
2010-12-14
Ngo, Ngan (Department: 2893)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
C257S004000, C257S190000, C257S154000, C257S536000, C257SE29141, C257SE45003, C257SE45001
Reexamination Certificate
active
07851888
ABSTRACT:
Non-volatile memories formed on a substrate and fabrication methods are disclosed. A bottom electrode comprising a metal layer is disposed on the substrate. A buffer layer comprising a LaNiO3film is disposed over the metal layer. A resistor layer comprising a SrZrO3film is disposed on the buffer layer. A top electrode is disposed on the resistor layer.
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Lin Chao-Cheng
Lin Chun-Chieh
Tseng Tseung-Yuen
Liu Benjamin Tzu-Hung
Muncy Geissler Olds & Lowe, PLLC
Ngo Ngan
Winbond Electronics Corp.
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