Nonradiative planar dielectric line and integrated circuit

Details Nonradiative planar dielectric line and integrated circuit Nonradiative planar dielectric line and integrated circuit

1998-06-05

2000-12-26

Gensler, Paul

Wave transmission lines and networks

Long lines

Waveguide type

333248, H01P 300, H01P 316

Patent

active

061666149

ABSTRACT:
A nonradiative planar dielectric line exhibits low transmission losses and is easily connectable to electronic components. A first slot is provided between two electrodes on a first main surface of a dielectric plate. A second slot is provided between two electrodes on a second main surface of the dielectric plate. A first conductor is electrically connected to the electrodes on the first main surface and also covers the first slot. A second conductor is electrically connected to the electrodes on the second main surface and also covers the second slot. An integrated circuit using the above type of dielectric line is also provided. Thus, apparatuses using the above dielectric lines or integrated circuits are miniaturized.

REFERENCES:
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Fernanded, et al, Metallization Thickness in Bilateral and Unilateral Finlines, Int'l. Frnl. of Infrared & Millimeter Waves, vol.15, No.6, pp.1001-1014 Jun. 1994.
European Search Report issued Sep. 30, 1999 in a related application.
Humberto Cesar Chaves Fernandez et al.; "Dispersion in Finlines on Semiconductor and the S-Parameters of a Step Discontinuity," International Journal of Infrared and Millimeter Waves, vol. 12, no. 5, 1 May 1991 (1991-05-01), pp 505-519, XP000206355, ISSN: 0199271, * page 506, line 31 -line 41 *,* page 510, 33 -line 38, Figures 1A, 8 *.
M. M. Ney et al.: "A Study of Electric-Field Breakdown in E-Plane Lines at Centimeter and Millimeter Wavelengths," IEEE Transactions on Microwave Theory and Techniques, vol. 35, no. 5, May, 1987 (1987-05), pp. 502-509, XP002115616, IEEE Inc. New York, US ISSN: 0018-9480, * Figures 1A, B*.
Eswarappa et al.: "Finlines in Rectangular and Circular Waveguide Housings Including Substrate Mounting and Bending Effects -Finite Element Analysis,"IEEE Transactions on Microwave Theory and Techniques, vol. 37, no. 2, 1 Feb. 1989 (1989-02-01), pp 299-306, XP000005544, ISSN: 0018-9480, * Figure 4 *.

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