Noncontact method of adhering a wafer to a wafer tape

Details Noncontact method of adhering a wafer to a wafer tape Noncontact method of adhering a wafer to a wafer tape

1997-12-18

1999-12-28

Lorin, Francis J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156382, 156285, B32B 3100

Patent

active

060076542

ABSTRACT:
A method and apparatus (10) for securing a fragile wafer (14) to a wafer tape (51) secured taut across a wafer frame (50). A controlled jet of gas (46) is directed by a nozzle (45) against the backside of the wafer tape (51) to securely adhere the wafer tape (51) to the backside of the wafer (14). Preferably, a spiral pattern (70) of air is directed by the nozzle (45) to secure the wafer tape (51) to the wafer (14) without forming air bubbles or creases between the wafer tape and wafer. Such a method and apparatus is especially suitable for securely adhering fragile wafers to wafer tape that are subsequently broken along kerfs and which wafers are inverted to allow particles to drop downwardly.

REFERENCES:
patent: 1728635 (1929-09-01), Snelling
patent: 3340795 (1967-09-01), Hartley
patent: 3483059 (1969-12-01), Dinter

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