Noncontact IC card

Details Noncontact IC card Noncontact IC card

2005-09-13

2005-09-13

Kim, Ahshik (Department: 2876)

Registers

Records

Conductive

C235S375000, C235S380000, C235S487000

Reexamination Certificate

active

06942156

ABSTRACT:
In an IC card, an IC module constructed by mounting an IC chip and an antenna circuit on a substrate is sandwiched between at least a pair of exterior films. The IC chip is sealed with resin on its outside and reinforced by a reinforcement material having a substantially circular shape with a diameter greater than a longest dimension value of the IC chip. The height variation amount of the shape of the reinforcement material on a surface thereof is within a range of 20 μm or less. The reliability of the IC chip is ensured while the outer appearance of the card and print characteristic are not degraded.

REFERENCES:
patent: 5821614 (1998-10-01), Hashimoto et al.
patent: 6008993 (1999-12-01), Kreft
patent: 6012641 (2000-01-01), Watada
patent: 6076737 (2000-06-01), Gogami et al.
patent: 6095423 (2000-08-01), Houdeau et al.
patent: 6186398 (2001-02-01), Kato et al.
patent: 6422468 (2002-07-01), Nishizawa et al.
patent: 6580481 (2003-06-01), Ueda et al.
patent: 6607135 (2003-08-01), Hirai et al.
patent: 2000-048151 (2000-02-01), None
patent: 2000-311225 (2000-11-01), None

Affiliated with

Also associated with

Rating

Noncontact IC card does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Noncontact IC card, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Noncontact IC card will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3414650