Nonaqueous powdered metal paste composition

Details Nonaqueous powdered metal paste composition Nonaqueous powdered metal paste composition

1984-09-11

1985-09-17

O'Keefe, Veronica

Metal treatment

Compositions

148 23, 148 24, 148 25, 148 26, B23K 3534, C23R 112

Patent

active

045418764

ABSTRACT:
There is provided a nonaqueous powdered metal paste composition and a vehicle therefor, characterized by resistance to slumping upon heating to the fusion point of the metal, fusion point being above 500.degree. C., including the powdered metal, and an organic material having a surface tension of from 43 to 65 or higher dynes/cm. at 20.degree. C.

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patent: 4460414 (1984-07-01), Hwang
"Technology of Electronic Grade Solder Paste", Taylor et al., Solid State Technology, Sep. 1981, pp. 127-135.

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