Non-wetting articles and method for soldering operations

Metal fusion bonding – Metallic heat applicator – Tip or head alloy or polymetallic structure

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Details

228215, 427249, 4272552, 428627, B23K 300, B23K 302

Patent

active

044201109

ABSTRACT:
A method providing for the non-wetting of predetermined portions of articles exposed to molten filler metals during soldering or brazing operations wherein predetermined areas of said elements are provided with a layer of chemical vapor deposited titanium carbide with an overlayer of titanium nitride or with a layer of titanium diboride to resist wetting of the coated areas by the filler metals. Articles coated by the non-wetting titanium compounds include circuit board support brackets and other elements used in immersion soldering machines, and heating elements for soldering operations such as soldering tips for various types of heated soldering tools and the like.

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