Non-uniform subaperture polishing

Details Non-uniform subaperture polishing Non-uniform subaperture polishing

2008-05-13

2008-05-13

Morgan, Eileen P. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With feeding of tool or work holder

C451S010000, C451S041000, C451S160000, C451S285000

Reexamination Certificate

active

11644856

ABSTRACT:
A method for subaperture polishing includes determining a first portion of a sample to be polished disproportionately compared to a second portion of the sample. Based on the determination of the first portion, a sweep frequency that is a first rate of lateral motion for a polishing pad is selected to be substantially equal to an integer multiple of a rotation frequency that is a rate of rotation for the sample. The method further includes rotating the polishing pad at the polishing frequency, rotating the sample at the rotation frequency, and polishing the sample using the polishing pad while rotating the polishing pad and the sample.

REFERENCES:
patent: 6033290 (2000-03-01), Gurusamy et al.
patent: 6540587 (2003-04-01), Gotkis et al.
patent: 6585572 (2003-07-01), Saldana et al.
patent: 6958005 (2005-10-01), Charatan
patent: 2001/0009843 (2001-07-01), Hirokawa et al.
patent: 2002/0188370 (2002-12-01), Saldana et al.
patent: 2006/0151110 (2006-07-01), Laursen et al.
patent: WO 02/24410 (2002-03-01), None

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