Non-thermogenic heat dissipating biomedical adhesive composition

Drug – bio-affecting and body treating compositions – Preparations characterized by special physical form – Web – sheet or filament bases; compositions of bandages; or...

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424443, 424449, 424484, 424485, 424486, 424 7835, 6048921, A61F 1302

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active

060107146

ABSTRACT:
A biocompatible monomer composition includes at least one monomer, which forms a medically acceptable polymer, and an effective amount of at least one heat dissipating agent sufficient to reduce exothermic polymerization temperature increase of the composition. The heat dissipating agent enhances patient comfort and prevents necrosis of living tissue normally encountered with such medical adhesives.

REFERENCES:
patent: 2721858 (1955-10-01), Joyner et al.
patent: 2768109 (1956-10-01), Coover, Jr. et al.
patent: 3254111 (1966-05-01), Hawkins et al.
patent: 3527841 (1970-09-01), Wicker, Jr. et al.
patent: 3554990 (1971-01-01), Quinn et al.
patent: 3559652 (1971-02-01), Banitt et al.
patent: 3722599 (1973-03-01), Robertson et al.
patent: 3759264 (1973-09-01), Coover, Jr. et al.
patent: 3940362 (1976-02-01), Overhults
patent: 3995641 (1976-12-01), Kronenthal et al.
patent: 4042442 (1977-08-01), Dombroski et al.
patent: 4131597 (1978-12-01), Bluethgen et al.
patent: 4187559 (1980-02-01), Grell et al.
patent: 4364876 (1982-12-01), Kimura et al.
patent: 4578061 (1986-03-01), Lemelson
patent: 4793330 (1988-12-01), Honeycutt et al.
patent: 4832688 (1989-05-01), Sagae et al.
patent: 4852568 (1989-08-01), Kensey
patent: 4890612 (1990-01-01), Kensey
patent: 4900303 (1990-02-01), Lemelson
patent: 4900546 (1990-02-01), Posey-Dowty et al.
patent: 5021059 (1991-06-01), Kensey et al.
patent: 5053046 (1991-10-01), Janese
patent: 5061274 (1991-10-01), Kensey
patent: 5108421 (1992-04-01), Fowler
patent: 5129882 (1992-07-01), Weldon et al.
patent: 5192300 (1993-03-01), Fowler
patent: 5221259 (1993-06-01), Weldon et al.
patent: 5222974 (1993-06-01), Kensey et al.
patent: 5258420 (1993-11-01), Posey-Dowty et al.
patent: 5275616 (1994-01-01), Fowler
patent: 5282827 (1994-02-01), Kensey et al.
patent: 5292332 (1994-03-01), Lee
patent: 5319011 (1994-06-01), Schoon
patent: 5324306 (1994-06-01), Makower et al.
patent: 5328687 (1994-07-01), Leung et al.
patent: 5330446 (1994-07-01), Weldon et al.
patent: 5370660 (1994-12-01), Weinstein et al.
patent: 5372585 (1994-12-01), Tiefenbrun et al.
patent: 5401508 (1995-03-01), Manesis
patent: 5582834 (1996-12-01), Leung et al.
patent: 5817708 (1998-10-01), Congelio et al.
Agah, R. et al., "Rate Process Model for Arterial Tissue Thermal Damage: Implications on Vessel Photocoagulation", Lasers in Surgery and Medicine, vol. 15, pp. 176-184 (1994).

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