Non-thermal process for forming porous low dielectric...

Details Non-thermal process for forming porous low dielectric... Non-thermal process for forming porous low dielectric...

2008-07-29

2008-07-29

Padgett, Marianne L (Department: 1792)

Coating processes

Direct application of electrical, magnetic, wave, or...

Pretreatment of substrate or post-treatment of coated substrate

C427S554000, C427S555000, C427S487000, C427S489000, C427S532000, C427S535000, C427S543000, C427S551000, C427S255370, C427S255393, C438S790000, C438S789000

Reexamination Certificate

active

10295568

ABSTRACT:
Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same. In certain embodiments of the invention, there is provided a low-temperature process to remove at least a portion of at least one pore-forming phase within a multiphasic film thereby forming a porous film. The pore-forming phase may be removed via exposure to at least one energy source, preferably an ultraviolet light source, in a non-oxidizing atmosphere.

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