Non-square die for integrated circuits and systems containing th

Details Non-square die for integrated circuits and systems containing th Non-square die for integrated circuits and systems containing th

1995-06-07

1998-04-28

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

257666, 257786, H01L 2906, H01L 23495, H01L 2348

Patent

active

057448566

ABSTRACT:
Electronic systems using certain non-square dies, such as triangular dies, greatly elongated rectangular dies, parallelogram dies, trapezoidal, and the like, are able to be laid out in the area of a circular semiconductor wafer more "efficiently" than square dies. Further, a peripheral area of these certain non-square dies is advantageously increased relative to the area contained within the peripheral area, to accommodate increased I/O connections to the active elements of the die.

REFERENCES:
patent: 4253280 (1981-03-01), Du Bois et al.
patent: 4498096 (1985-02-01), Addie et al.
patent: 5329157 (1994-07-01), Rosotker
"VLSI Processor Architectures"; pp. 33-45; Philip C. Trevealen; Jun. 1982.

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