Non-silicon and silicon bonded structure and method of manufactu

Details Non-silicon and silicon bonded structure and method of manufactu Non-silicon and silicon bonded structure and method of manufactu

1990-08-31

1994-01-25

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Heterojunction device

Heterojunction formed between semiconductor materials which...

257183, 257499, H01L 2926

Patent

active

052818349

ABSTRACT:
A non-silicon substrate is bonded to a silicon substrate with a stress-relief layer between the non-silicon substrate and the silicon substrate. The stress-relief layer reduces the stress between the non-silicon substrate and the silicon substrate. The stress is created by the difference in the thermal expansion coefficients of the two materials. The stress-relief layer may be a low melting point metal, a semiconductor layer having its thermal expansion coefficient close to the thermal expansion coefficient of the non-silicon substrate. The silicon substrate and/or the non-silicon substrate may have a silicon dioxide layer formed thereon such that the silicon dioxide layer is adjacent to the stress-relief layer.

REFERENCES:
patent: 3935040 (1976-01-01), Mason
patent: 4632712 (1986-12-01), Fan et al.
patent: 4639277 (1987-01-01), Hawkins
patent: 4717681 (1988-01-01), Curran
patent: 4845044 (1989-07-01), Ariyoshi et al.
patent: 4891329 (1990-01-01), Reisman et al.
patent: 4928154 (1990-05-01), Umeno et al.
patent: 4963949 (1990-10-01), Wanlass et al.

Affiliated with

Also associated with

Rating

Non-silicon and silicon bonded structure and method of manufactu does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Non-silicon and silicon bonded structure and method of manufactu, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Non-silicon and silicon bonded structure and method of manufactu will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-729814