Non-rigid conductor link measurement sensor and method for...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C257S420000, C257S692000, C438S117000, C029S874000

Reexamination Certificate

active

07400514

ABSTRACT:
The invention relates to electronic sensors comprising an electromechanical microsensor cell such as a micro-accelerometer, and it more particularly relates to the way in which the microsensor cell per se is mounted in a package that furthermore comprises a printed circuit board carrying the electronic processing circuits associated with the microsensor cell. In order to establish a non-rigid electrical connection between a conductive terminal of the board and a connection pin of the cell, a narrow strip-shaped conductive connection cut by chemical machining from a thin and flexible metal sheet (CuBe) is soldered. The strip comprises at least one circle-arc segment extending over one half-turn or three-fourths of a turn. Its resilience permits very low stiffness in all directions and therefore prevents any transmission of vibrations or shocks to the cell. The manufacture of the connections may be collective for all the connections of a sensor and for successive sensors manufactured serially. Application to accelerometers subjected to large shock and vibration stresses.

REFERENCES:
patent: 4422128 (1983-12-01), Heltmach, Jr. et al.
patent: 5185042 (1993-02-01), Ferguson
patent: 5767404 (1998-06-01), Kaiser et al.
patent: 2003/0057515 (2003-03-01), Fillion et al.
patent: 2003/0121698 (2003-07-01), Kyougoku et al.
patent: 42 40 454 (1994-06-01), None
patent: 0 540 071 (1993-05-01), None
patent: 1996-05-22 (1996-05-01), None

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