Non-rectilinear polygonal vias

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Reexamination Certificate

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C438S640000

Reexamination Certificate

active

06882055

ABSTRACT:
Some embodiments of the invention provide vias that are not in shape of quadrilaterals. In some embodiments, some or all vias are in shape of non-quadrilateral polygons, such as octagons and hexagons. In some embodiments, some or all vias have a circular shape. Some embodiments provide a first set of vias that have a diamond shape and a second set of vias that have a rectangular shape. In some embodiments, a via can also be formed by a diamond contact and a rectangular contact. The diamond contact has four sides. In the embodiments described below, all four sides of a diamond via contact have equal sides. However, in other embodiments, a via contact can be in shape of a diamond with a pair of sides that are longer than the other pair of sides. Similarly, in the embodiments described below, the rectangular via contacts are squares with four equal sides. However, in other embodiments, the length and width of a rectangular via contact can differ. Some embodiments of the invention provide interconnect lines that have non-rectangular ends. In some embodiments, the interconnect-line ends are partial octagons, hexagons, and/or circles. Also, some embodiments provide Steiner points that are not rectangular. In some embodiments, the Steiner points are octagonal, hexagonal, or circles.

REFERENCES:
patent: 4615011 (1986-09-01), Linsker
patent: 4673966 (1987-06-01), Shimoyama
patent: 4700016 (1987-10-01), Hitchcock et al.
patent: 4782193 (1988-11-01), Linsker
patent: 5360948 (1994-11-01), Thornberg
patent: 5401912 (1995-03-01), Mattei
patent: 5578840 (1996-11-01), Scepanovic et al.
patent: 5618744 (1997-04-01), Suzuki et al.
patent: 5633479 (1997-05-01), Hirano
patent: 5650653 (1997-07-01), Rostoker et al.
patent: 5657242 (1997-08-01), Sekiyama et al.
patent: 5742086 (1998-04-01), Rostoker et al.
patent: 5757656 (1998-05-01), Hershberger et al.
patent: 5777360 (1998-07-01), Rostoker et al.
patent: 5784262 (1998-07-01), Sherman
patent: 5811863 (1998-09-01), Rostoker et al.
patent: 5822214 (1998-10-01), Rostoker et al.
patent: 5889329 (1999-03-01), Rostoker et al.
patent: 5914887 (1999-06-01), Scepanovic et al.
patent: 5973376 (1999-10-01), Rostoker et al.
patent: 6035108 (2000-03-01), Kikuchi
patent: 6067409 (2000-05-01), Scepanovic et al.
patent: 6128767 (2000-10-01), Chapman
patent: 6166441 (2000-12-01), Geryk
patent: 6209123 (2001-03-01), Maziasz et al.
patent: 6226560 (2001-05-01), Hama
patent: 6262487 (2001-07-01), Igarashi et al.
patent: 6301686 (2001-10-01), Kikuchi et al.
patent: 6320391 (2001-11-01), Bui
patent: 6324675 (2001-11-01), Dutta et al.
patent: 6342682 (2002-01-01), Mori et al.
patent: 6365958 (2002-04-01), Ibnabdeljalil et al.
patent: 6385758 (2002-05-01), Kikuchi et al.
patent: 6407434 (2002-06-01), Rostoker et al.
patent: 6412097 (2002-06-01), Kikuchi et al.
patent: 6436804 (2002-08-01), Igarashi et al.
patent: 6483481 (2002-11-01), Sievenpiper et al.
patent: 6512292 (2003-01-01), Armbrust et al.
patent: 6546540 (2003-04-01), Igarashi et al.
patent: 6586281 (2003-07-01), Gabara et al.
patent: 6615400 (2003-09-01), Lukanc
patent: 6645842 (2003-11-01), Igarashi et al.
patent: 20010003843 (2001-06-01), Scepanovic et al.
patent: 20020024115 (2002-02-01), Ibnabdeljalil et al.
patent: 20020174413 (2002-11-01), Tanaka
patent: 20020182844 (2002-12-01), Igarashi et al.
patent: 20030003761 (2003-01-01), Yang et al.
patent: 20030005399 (2003-01-01), Igarashi et al.
patent: 20030025205 (2003-02-01), Shively
patent: 20030121017 (2003-06-01), Andreev et al.
patent: 03-173471 (1991-07-01), None
patent: 04-000677 (1992-01-01), None
patent: 05-102305 (1993-04-01), None
patent: 05-243379 (1993-09-01), None
patent: 07-086407 (1995-03-01), None
patent: 09-162279 (1997-06-01), None
patent: 2000-082743 (2000-03-01), None
Berger, B. et al., Nearly Optimal Algorithms and Bounds for Multilayer Channel Routing, Journal of the Association for Computing Machinery, pp. 500-542, Mar. 1995.
Chen, H., Routing L-Shaped Channels in Nonslicing-Structure Placement. 24thACM-IEEE Design Automation Conference, pp. 152-165, 1987.
Cheng, K. et al., Manhattan or Non Manhattan? A Study of Alternative VLSI Routing Architectures, pp. 47-52, 2000.
Chiang, C. et al., Wirability of Knock-Knee Layouts with 45° Wires, IEEE Transactions on Circuits and Systems, vol. 38, Issue 6, pp. 613-624, Jun. 1991.
NN71091316, Use of Relatively Diagonal And Rectangular Wiring Planes n Multilayer Packages, Sep. 1971, IBM Technical Disclosure Bulletin, vol. No. 14, Issue No. 4, pp. 1316-1317.
Overtone, G., EDA Underwriter 2 Finding Space in a Multi-Layer Board, Electronic Engineering, Morgan-Grampian LTD, vol. 67, No. 819, pp. 29-30.
U.S. patent application Ser. No. 10/066,060, Steven Teig, filed Jan. 31, 2002.
U.S. patent application Ser. No. 10/066,160, Steven Teig et al., filed Jan .31, 2002.
U.S. patent application Ser. No. 10/066,095, Steven Teig et al., Jan. 31, 2002.
U.S. patent application Ser. No. 10/061,641, Steven Teig et al., filed Jan. 31, 2002.
U.S. patent application Ser. No. 10/066,094, Steven Teig et al., filed Jan. 31, 2002.
U.S. patent application Ser. No. 10/076,121, Steven Teig, filed Feb. 12, 2002.
U.S. patent application Ser. No. 10/062,995, Steven Teig et al., filed Jan. 31, 2002.
U.S. patent application Ser. No. 10/066,102, Steven Teig, filed Jan. 31, 2002.
U.S. patent application Ser. No. 10/066,187, Steven Teig et al., filed Jan. 31, 2002.
U.S. patent application Ser. No. 10/233,202, Steven Teig, filed Aug. 28, 2002.
U.S. patent application Ser. No. 10/229,196, Steven Teig, filed Aug. 26, 2002.
U.S. patent application Ser. No. 10/288,870, Steven Teig, filed Nov. 6, 2002.
U.S. patent application Ser. No. 10/219,923, Steven Teig, filed Aug. 14, 2002.

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