Abrasive tool making process – material – or composition – With synthetic resin
Reexamination Certificate
2006-05-02
2006-05-02
Marcheschi, Michael (Department: 1755)
Abrasive tool making process, material, or composition
With synthetic resin
C051S300000, C051S307000, C051S308000, C051S309000, C106S003000, C438S692000, C438S693000
Reexamination Certificate
active
07037351
ABSTRACT:
An abrasive composition comprising non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The inventive compositions preferably comprise soft water in combination with 0.001–20 w/w % of non-polymeric organic particles, 0.1–10 w/w % of an oxidizing agent, 0.05–10 w/w % of a chelating agent, 0.01–10 w/w % of a surfactant, and 0–10 w/w % of a passivation agent at a pH in the range of 2–12, wherein said percentages are w/w (weight/weight) percentages, based on the total weight of said compositions. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.
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Bian Guomin
Cheemalapati Krishnayya
Chowdhury Atanu Roy
Li Yuzhuo
Tang Kwok
Birch & Stewart Kolasch & Birch, LLP
Dynea Chemicals Oy
Marcheschi Michael
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