Non-plasma reaction apparatus and method

Details Non-plasma reaction apparatus and method Non-plasma reaction apparatus and method

2002-11-27

2009-02-24

Lund, Jeffrie R (Department: 1792)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With gas inlet structure

C156S345330, C156S345290, C118S715000

Reexamination Certificate

active

07494560

ABSTRACT:
An apparatus and method for forming a self-limiting etchable layer on a workpiece. The apparatus comprises: a chamber adapted for holding a workpiece; a distribution plate within the chamber, wherein the distribution plate includes channels for introducing a first fluid (e.g., ammonia) and a second fluid (e.g., hydrogen fluoride) into the apparatus, such that the first and second fluids may be directed into the apparatus at the angles θ1and θ2with respect to an exposed surface of the distribution plate, wherein the channels for each type of fluid may be arranged respectively in alternating rings, and wherein each angle θ1and θ2are at least 45 degrees and less than 90 degrees, offset by α2and β2and α1and β1by analogy. The method for forming the etchable layer on the workpiece comprises introducing a first fluid and a second fluid into the chamber through the channels.

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