Non-photolithographic etch mask for submicron features

Etching a substrate: processes – Masking of a substrate using material resistant to an etchant – Resist material applied in particulate form or spray

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216 11, 216 49, H01L 21302

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active

058110208

ABSTRACT:
A non-photlithographic, physical patterning process, which is useful for selectively etching of a substrate, is provided. The process comprises electrostatically charging liquid droplets which are selectively etchable with respect to the substrate, dispersing the droplets onto substrate in a pattern; and etching the substrate using the droplets as a mask.

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