Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Patent
1992-09-30
1994-06-14
Bradley, Paula A.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
By partial or total immersion of work or applicator into liquid
2281801, 228219, 432250, B23K 300
Patent
active
053202740
ABSTRACT:
A soldering apparatus includes a conveyor adapted to carry assembled circuit boards through a soldering chamber. A wave of solder is created in the chamber. The chamber has a curtain at its entrance and a curtain at its exit. Gas distributors are located within the chamber and are able to introduce nitrogen into the chamber in order to create a non-oxidizing atmosphere in the vicinity of the wave. In operation, the wave of solder wets connecting points between the components and the board to form permanent joints on solidification of the solder. The bottom edge of the curtain is of a shape complementary to the front elevation of the assembled circuit boards to be soldered and is arranged such that the circuit boards just pass thereunder without making contact with it.
REFERENCES:
patent: 4580716 (1986-04-01), Barresi et al.
patent: 4838476 (1989-06-01), Rahn
patent: 4921156 (1990-05-01), Hohnerlein
patent: 5161727 (1992-11-01), Leturmy et al.
Patent Abstract of Japan, vol. 6, No. 26 (M-112) Feb. 16, 1982 & JP-A-56 144 860 (Fuji Electric Co Ltd) Apr. 14, 1980; "Conveyor Furnace".
Precious Colin J.
Thomas Raymund
Bradley Paula A.
Cassett Larry R.
Elpel Jeanne M.
Rosenblum David M.
The BOC Group plc
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