Non-occluding mounting hole with solder pad for printed circuit

Details Non-occluding mounting hole with solder pad for printed circuit Non-occluding mounting hole with solder pad for printed circuit

1988-08-24

1989-07-25

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

29843, 29854, H05K 100, H05K 334

Patent

active

048516147

ABSTRACT:
A novel solder pad configuration for printed circuit boards is disclosed which is resistant to solder occlusion upon wave soldering. On the solder side of the circuit board the solder pad is substantially C-shaped and partially surrounds a non-plated through-hole. Via holes prvide electrical connection between the pad on the solder side of the board and the corresponding pad on the component side of the circuit boards. The invention is particularly applicable to the chassis ground mounting holes of PCB's.

REFERENCES:
patent: 3567844 (1971-03-01), Kremar
patent: 3865298 (1975-02-01), Allen et al.
patent: 3883682 (1975-05-01), Cagle et al.
patent: 4438560 (1984-03-01), Kisters
patent: 4524239 (1985-06-01), Rouge
patent: 4638116 (1987-01-01), Gumb
Glasson, J. M. et al., Programmable Through-Hole Connection; Western Electric Technical Digest No. 20; Oct. 1970, p. 33.
Donald A. Elliott, "Hot Air Leveling of Printed Wiring Boards", Presented at Nepcon-East, Philadelphia, May 17-19, 1977.

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