Non-metallic chassis structure with electromagnetic field attenu

Details Non-metallic chassis structure with electromagnetic field attenu Non-metallic chassis structure with electromagnetic field attenu

1987-10-19

1988-09-06

Buczinski, Stephen C.

Electricity: electrical systems and devices

Miscellaneous

174 35MS, 29460, H05K 900, B23P 1904

Patent

active

H00005266

ABSTRACT:
An electronic equipment chassis structure using non-metallic plastic material such as epoxy-impregnated fiberglass together with layers of shielding metal film, preferably of copper overlaid by nickel. Desirable radio frequency shielding is achieved in comparison with the metal chassis structures and in the presence of decreased chassis mass, lower fabrication cost and chassis change enabling flexibility. Examples of material characteristics, representative fabrication costs, and attained radio frequency attenuation properties are included.

REFERENCES:
patent: 3007160 (1961-10-01), Halpern
patent: 3187281 (1965-06-01), Weiner et al.
patent: 3230375 (1986-01-01), Wagoner et al.
patent: 3332860 (1967-07-01), Diebold et al.
patent: 3806928 (1974-04-01), Costanza
patent: 3816911 (1974-06-01), Knappenberger
patent: 3938152 (1976-02-01), Grimes et al.
patent: 4371742 (1983-02-01), Manly
patent: 4408255 (1983-10-01), Adkins
patent: 4544571 (1985-10-01), Miller

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