Non-magnetic, hermetically-sealed micro device package

Details Non-magnetic, hermetically-sealed micro device package Non-magnetic, hermetically-sealed micro device package

2007-08-07

2007-08-07

Wilczewski, M. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S116000, C257S677000, C257S710000, C257S729000

Reexamination Certificate

active

10797457

ABSTRACT:
A process for preparing an electronic package comprising: (a) providing a ceramic housing defining an internal cavity for receiving a micro device and having one or more interface portions; (b) treating the housing to form a tungsten layer on the interface portions; and (c) overlaying a palladium layer on the tungsten layer.

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