Non-linear resistor stack and its method of assembly

Details Non-linear resistor stack and its method of assembly Non-linear resistor stack and its method of assembly

1982-02-01

1983-12-27

Albritton, C. L.

Electrical resistors

Resistance value responsive to a condition

Current and/or voltage

H01C 712

Patent

active

044234040

ABSTRACT:
Non-linear resistors especially suitable for assembling into a stack are disclosed herein along with the stack and its method of assembly. Each resistor has opposite end surfaces to which a certain electrically conductive bonding substance, specifically solder, will adhere and an outer circumferential side surface extending between the end surfaces. The entire side surface of each wafer is covered with a coating layer formed from a dielectric composition to which the specific bonding substance will not adhere. This composition is also one which is able to withstand coming into contact with the bonding substance when the latter is in a liquid state, that is, it is able to withstand the temperature of molten solder when solder is used as the bonding substance and it must also be able to withstand the expected voltage and current levels across the wafer without any adverse effects. These coated wafers are bonded together in an end-to-end relationship with one another so as to form a stack using the solder or other such specific bonding substance.

REFERENCES:
patent: 3905006 (1975-09-01), Matsuoka et al.
patent: 3959543 (1976-05-01), Ellis
patent: 4031498 (1977-06-01), Hayashi et al.
patent: 4148135 (1979-04-01), Sakahaug et al.
patent: 4319215 (1982-03-01), Yamazaki et al.

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