Non-leaded solders

Details Non-leaded solders Non-leaded solders

1991-09-19

1992-04-07

Zimmerman, John

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

420560, B32B 1520, C22C 1300, B23K 3526

Patent

active

051027488

ABSTRACT:
Non-leased solders formed of tin, copper and selenium or tellurium. Such solders display lower melting points than other non-leaded solders, and their narrow pasty range allows them to set up easily in the field. Such solders also display superior tensile strength, shear strength and hardness properties, and are less expensive to produce than conventional non-leaded solders which contain tin/copper/silver formulations or formulations of four or more elements.

REFERENCES:
patent: 1239195 (1917-09-01), Lorentowicz
patent: 2059019 (1936-10-01), Palm et al.
patent: 2124589 (1936-07-01), Palm
patent: 3087813 (1963-04-01), Ueno et al.
patent: 3146097 (1964-08-01), Allen
patent: 4248905 (1981-02-01), Harvey
patent: 4357162 (1982-11-01), Guan
patent: 4358884 (1982-11-01), Harvey et al.
patent: 4362576 (1982-12-01), Harvey
patent: 4374904 (1983-02-01), Harvey
patent: 4492602 (1985-01-01), Lee et al.
patent: 4540437 (1985-09-01), Patel
patent: 4634044 (1987-01-01), Hargrove et al.
patent: 4643875 (1987-02-01), Mizuhara
patent: 4670217 (1987-06-01), Henson et al.
patent: 4695428 (1987-09-01), Ballentine et al.
patent: 4758407 (1988-07-01), Ballentine et al.
patent: 4778733 (1988-10-01), Lubrano et al.
patent: 4806309 (1990-02-01), Tulman

Affiliated with

Also associated with

Rating

Non-leaded solders does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Non-leaded solders, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Non-leaded solders will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1894423