Non-leaded semiconductor package and a method to assemble...

Details Non-leaded semiconductor package and a method to assemble... Non-leaded semiconductor package and a method to assemble...

2004-02-26

2010-06-08

Le, Dung A. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S108000, C438S111000, C438S112000, C257S066000, C257S676000, C257SE23037, C257SE21510

Reexamination Certificate

active

07732259

ABSTRACT:
A method to assemble a non-leaded semiconductor package is disclosed. In one embodiment, a carrier tape is attached to a metal foil. A plurality of leadframes are formed in the metal foil, each leadframe including a die pad laterally surrounded by a plurality of contact leads. A semiconductor die, including an active surface with a plurality of die contact pads, is attached to each die attach pad and electrically connected to the leadframe by a plurality of bond wires connecting the die contact pads and the lead contact areas of the contact leads. A plurality of leadframes, each including a wire bonded semiconductor die, are encapsulated with mold material. The carrier tape is removed and the non-leaded semiconductor packages separated.

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patent: 486 795 (2002-05-01), None

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