Non-impact thermocompression gang bonding method

Details Non-impact thermocompression gang bonding method Non-impact thermocompression gang bonding method

1983-08-11

1986-08-26

Ramsey, Kenneth J.

Metal fusion bonding

Process

Using a compliant cushioning medium

2281802, 228212, 228240, 228234, B23K 1900

Patent

active

046077790

ABSTRACT:
A non-impact form of thermocompression gang bonding of metal lead fingers to integrated circuit chip pads is disclosed. The method produces a plurality of simultaneously bonded chips using conventional heating means and totally avoids mechanical and thermal shock. The result is highly reliable bonding that results in exceptionally high bond strength.

REFERENCES:
patent: 3158927 (1964-12-01), Saunders
patent: 3486223 (1969-12-01), Butera
patent: 3617682 (1971-11-01), Hall
patent: 3633267 (1972-01-01), Deminet et al.
patent: 3646670 (1972-03-01), Maeda et al.
patent: 3665590 (1972-05-01), Percival
patent: 3670396 (1972-06-01), Lindberg
patent: 3838240 (1974-09-01), Schelhorn
patent: 3859723 (1975-01-01), Hamer et al.
patent: 3941297 (1976-03-01), Burns et al.
patent: 3964666 (1976-06-01), Dinella et al.
patent: 3982979 (1976-09-01), Hentz et al.
patent: 4000842 (1977-01-01), Burns
patent: 4204628 (1980-05-01), Houston et al.
patent: 4209355 (1980-06-01), Burns

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