Non-hermetically sealed stackable chip carrier package

Details Non-hermetically sealed stackable chip carrier package Non-hermetically sealed stackable chip carrier package

1981-12-17

1984-03-20

McQuade, John

Geometrical instruments

399 17CF, 399 75M, 399143R, 399DIG3, H01R 909

Patent

active

044377185

ABSTRACT:
An improved stackable integrated chip carrierassembly is disclosed which is especially suited for use in printed circuit board with dense configuration of components in limited areas of surface. The chip carrier assembly is mounted on an associated circuit board and allows the vertical stacking of active components in chip form, integral therein. The interconnections of the associated integrated circuit chips are accomplished without soldering which lends itself for easy disassembly when it becomes necessary to remove or replace an internal chip. The chip carrier assembly has an adaptable design allowing single or vertically stacked utilization of the module-like package. To achieve the necessary electrical isolation property, a ceramic cap is placed at the upper most position relative to the integrated module assembled package. This design has relatively few parts and allows smaller diameter wire to be used to achieve the required integrated circuit chip to package electrical bonding connections, when such is required.

REFERENCES:
patent: 3340439 (1967-09-01), Henschen et al.
patent: 3370203 (1968-02-01), Kravitz et al.
patent: 3795884 (1974-03-01), Kotaka
patent: 3885173 (1975-05-01), Lee
patent: 3904934 (1975-09-01), Martin
patent: 3917983 (1975-11-01), Kuronen
patent: 3991463 (1976-11-01), Squitieri et al.
patent: 3998512 (1976-12-01), Anhalt et al.
patent: 4018494 (1977-04-01), Scheingold et al.
patent: 4045105 (1977-08-01), Lee et al.
patent: 4144648 (1979-03-01), Grovender
patent: 4255003 (1981-03-01), Berg
patent: 4344662 (1982-08-01), Dalamangas et al.
patent: 4357061 (1982-11-01), Crosby
Electronics'; Jan. 17, 1980 "4-Chip Hybrid Carrier Holdsdown System Costs" by Dan I. Amey and Jack W. Balde.

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