Non-hazardous wet etching method

Details Non-hazardous wet etching method Non-hazardous wet etching method

1998-02-27

2000-08-15

Gorgos, Kathryn

Electrolysis: processes, compositions used therein, and methods

Electrolytic erosion of a workpiece for shape or surface...

Electrolyte composition or defined electrolyte

205674, B23H 300, B23H 500, C25F 300, C25F 700, H05K 307

Patent

active

061030953

ABSTRACT:
A method for selectively wet etching material during the formation of a field emission display device. In one embodiment, the selective wet etching method comprises immersing, in a fluid bath, a structure having a conductive row layer and a resistor layer. The structure further includes a pad area. In this embodiment, the fluid bath includes an organic-acid etchant. The present embodiment then applies a potential to the structure such that exposed regions of the resistor layer are selectively wet etched without significantly etching the conductive row layer or the pad area. In so doing, the present embodiment etches selected materials without requiring the use of highly toxic and hazardous conventional etchants.

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Hubner et al. (The Pratical Anodising of Aluminum, Macdonald & Evans, London, pp. 20-25, no month available), 1960.

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