Alloys or metallic compositions – Lead base – Tin containing
Patent
1989-10-05
1990-12-04
Morris, Theodore
Alloys or metallic compositions
Lead base
Tin containing
420589, C22C 1106, C22C 1110
Patent
active
049752448
ABSTRACT:
Soft soldering compositions posessing equal or better melting, wetting and strength properties than conventional straight tin-lead solders but with a reduced tin content are disclosed. The compositions consist of 1-35 wt % tin, 5-30 wt % cadmium 0.05-2.5 wt % antimony, balance essentially lead with 5-30 wt % cadmium, and/or 1-15 wt % bismuth. The solder alloys are characterized by their improved properties concerning solidification temperature gap, spread percentage, wetting time and shear strength. Specific compositions are disclosed having the necessary properties to successfully replace the tradional tin-lead solders containing 30, 40 and 50 wt % tin. The high temperature performance of bonds made with these new alloys are better because of their reduced tendency of intermetallic compounds formation with the substrate due to their lower tin content. In addition their production costs are attractive, being lower than those of their conventional tin-lead counterparts, making them competitive on the market of mechanical or electric mass-soldering applications.
REFERENCES:
patent: 1301688 (1919-04-01), Gurevich et al.
patent: 2303193 (1942-11-01), Bouton et al.
patent: 2303194 (1942-11-01), Bouton et al.
patent: 4231794 (1980-11-01), Moranne
Dirnfeld Shraga
Ramon Jean
Morris Theodore
Phipps Margery S.
Technion Research & Development Foundation Ltd.
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