Non-dripping nozzle apparatus

Details Non-dripping nozzle apparatus Non-dripping nozzle apparatus

2007-07-10

2007-07-10

Tadesse, Yewebdar (Department: 1734)

Coating apparatus

Projection or spray type

C118S305000, C118S313000, C118S052000

Reexamination Certificate

active

10743928

ABSTRACT:
According to one aspect of the invention, a dispense head for a wafer processing apparatus is provided. The dispense head may include an inlet, at least one outlet, a drain, and a passageway therethrough interconnecting the inlet, the outlet, and the drain. The inlet may be at a first height above a bottom of the passageway, the outlet may be at a second height above the bottom, and the drain may be at a third height above the bottom. A first valve may be connected to the inlet, and a second valve may be connected to the drain. When the first valve is opened and the second valve is closed, fluid flows into the inlet and out of the outlet. When the second valve is opened and the first valve is closed, fluid from the passageway flows out of the drain. A pump may be connected to the drain.

REFERENCES:
patent: 5405443 (1995-04-01), Akimoto et al.
patent: 5435885 (1995-07-01), Jones et al.
patent: 5962070 (1999-10-01), Mitsuhashi et al.
patent: 2002/0053319 (2002-05-01), Nagamine
patent: 2002/0121341 (2002-09-01), Tanaka et al.
patent: 2004/0222323 (2004-11-01), Akasaka et al.
patent: WO 03/049868 (2003-06-01), None
patent: PCT/US2004/041202 (2004-10-01), None

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