Non-destructive method of determining substrate tilt within a pa

Details Non-destructive method of determining substrate tilt within a pa Non-destructive method of determining substrate tilt within a pa

1996-09-16

1998-10-27

Williams, Hezron

Measuring and testing

Vibration

By mechanical waves

73629, 438 14, 438 15, G01N 2910

Patent

active

058279709

ABSTRACT:
A non-destructive method of determining substrate tilt within a packaged component includes providing the packaged component (10) with a component surface (32), providing a substrate (22) in the packaged component (10) wherein the substrate (22) has a substrate surface (33), using an acoustic wave (50) to measure a distance (34) between the component surface (32) and a region on the substrate surface (33), using another acoustic wave (53) to measure another distance (35) between the component surface (32) and a different region on the substrate surface (33), and comparing the distances (34, 35) to a threshold value.

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