Non-destructive interconnect system for semiconductor devices an

Details Non-destructive interconnect system for semiconductor devices an Non-destructive interconnect system for semiconductor devices an

1996-09-20

1998-04-21

Paumen, Gary F.

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439331, H01R 909

Patent

active

057411417

ABSTRACT:
An interconnect system for providing electrical connection to bond pads of a semiconductor device (14) includes a socket (18) having a plurality of conductors (16) and a carrier assembly (10) receivable in the socket (18) carrying a semiconductor device (14). The carrier assembly comprises a substrate assembly (12) and a latch assembly (22, 122, 222). The substrate assembly (12) includes a substrate (12a) having a complaint membrane (12f) and a plurality of contact bumps (12i) on a top surface of the complaint membrane (12c) for contacting bond pads on the semiconductor device (14). The force applying latch assembly (22, 122, 222) applies pressure in making a temporary electrical connection between contact bumps (12i) and the bond pads of semiconductor device (14). Latch assembly (222) comprises a latch (232) which cooperates with a spring (231) to place a force on a lid (224, 324, 424) which in turn places a force on the semiconductor device (14). An ejector member (250, 350) is mounted on the lid to apply a force on the semiconductor device to separate the semiconductor from the lid upon removal of the lid from the carrier assembly (10).

REFERENCES:
patent: 5127837 (1992-07-01), Shah et al.
patent: 5397245 (1995-03-01), Roebuck et al.
patent: 5468157 (1995-11-01), Roebuck et al.
patent: 5468158 (1995-11-01), Roebuck et al.

Affiliated with

Also associated with

Rating

Non-destructive interconnect system for semiconductor devices an does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Non-destructive interconnect system for semiconductor devices an, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Non-destructive interconnect system for semiconductor devices an will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2053204