Non-destructive interconnect system for semiconductor devices

Details Non-destructive interconnect system for semiconductor devices Non-destructive interconnect system for semiconductor devices

1993-10-29

1995-11-21

Nguyen, Khiem

Electrical connectors

Coupling part with actuating means urging contact to move...

Contractile receptacle

439 71, 439 73, H01R 1315

Patent

active

054681570

ABSTRACT:
An interconnect system (8) for providing electrical connection to bond pads on a semiconductor device (21) includes a socket (12) having a plurality of conductors (46) with retractable contact portions (14) and a carrier assembly (40) mounted on the socket (12) for carrying a semiconductor device (21). The carrier assembly (40) includes a substrate (17) having a compliant membrane (20b), a plurality of contact bumps (24) containing oxide-penetrating particles on a top surface of the compliant membrane (20b) for contacting bond pads on the semiconductor device (21), a fence (30) attached to the top surface of the compliant membrane (20b) for positioning the semiconductor device (21) so that the bond pads on the semiconductor device (21) are aligned with the contact bumps (24). Compliant membrane (20b) is part of a thin film interconnect (20). Contact bumps (24) are connected electrically with conductors (46) by conductive traces (19) and contact pads (18) formed on the thin film interconnect (20). The interconnection system (8) provides non-destructive interconnection to semiconductor device (21).

REFERENCES:
patent: 4684184 (1987-08-01), Grabbe et al.
patent: 4832612 (1989-05-01), Grabbe et al.
patent: 4846703 (1989-07-01), Matsuoka et al.
patent: 5127837 (1992-07-01), Shah et al.
patent: 5180976 (1993-01-01), Van Loan et al.

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