Measuring and testing – Vibration – By mechanical waves
Patent
1993-10-05
1995-06-27
Williams, Hezron E.
Measuring and testing
Vibration
By mechanical waves
73597, 367 99, G01N 2904
Patent
active
054269784
ABSTRACT:
The flaw detecting apparatus comprises a sensor head including a first sensor for detecting the center of the center hole and a second sensor for detecting a flaw. A driver moves the sensor head along a first line passing through the center hole and then along a second line passing through the center of the center hole and perpendicular to the first line, thereby placing the sensor head at a position facing the center hole, on the basis of the output of the first sensor. Subsequently, the driver rotates the sensor head to a predetermined position where a flaw is detected, on the basis of the output of the second sensor.
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Handbook of Non-Destructive Inspection, Nikkan Kogyo Shinbun-sha Apr. 28, 1978, pp. 480-482 & 494-495.
Kwok Helen C.
Mitsubishi Denki & Kabushiki Kaisha
Williams Hezron E.
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