Metal fusion bonding – With means to handle work or product
Patent
1989-03-03
1990-10-23
Godici, Nicholas P.
Metal fusion bonding
With means to handle work or product
228254, 269900, 269903, 118500, 118503, B23K 3704, B23Q 300
Patent
active
049645609
ABSTRACT:
A non-dedicated pallet assembly (10) is provided to carry and precisely position a plurality of integrated circuit package (12). The pallet assembly includes an exterior frame subassembly (14) encompassing an interior frame subassembly (16) formed to include a plurality of receiving nests (48) arrayed in rows thereon. Each receiving nest (48) is adapted to receive a modular package holder (18) in one of several selectable rotational orientations. The preferred modular package holders (18) may be in the form of a finger support holder (126), a surface protection holder (128) or a multi-nest holder (130), each conformed to the shape and dimensions of a selected package (12). Vertical support to the package holders (18) and the packages (12) is provided by a leaf spring (60) associated with each receiving nest (48) and by an openable and closable gate subassembly (20) associated with each pair of rows of receiving nests (48). The gate subassemblies (20) include gate bars (68) having anchor elements (100) adapted to engage the chip packages (12) when the gate is closed. The primary expected usage of the pallet assembly (10) is in wave soldering operations on chip packages (12) of various configurations.
REFERENCES:
patent: 4700935 (1987-10-01), Winslow et al.
patent: 4747532 (1988-05-01), Sim
patent: 4787550 (1988-11-01), Masuda et al.
Godici Nicholas P.
Heinrich Samuel M.
Hughes Michael J.
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