Non-dedicated pallet assembly for wave soldering packaged integr

Metal fusion bonding – With means to handle work or product

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Details

228254, 269903, 269900, 269239, 269 40, 118500, 118503, B23Q 300, B23K 3704

Patent

active

048711063

ABSTRACT:
A non-dedicated pallet assembly (10) is provided to carry and precisely position a plurality of integrated circuit packages (12). The pallet assembly includes an exterior frame subassembly (14) emcompassing an interior frame subassembly (16) formed to include a plurality of receiving nests (48) arrayed in rows thereon. Each receiving nest (48) is adapted to receive a modular package holder (18) in one of several selectable rotational orientations. The preferred modular package holders (18) may be in the form of a finger support holder (126), a surface protection holder (128) or a multi-nest holder (130), each conformed to the shape and dimensions of a selected package (12). Vertical support to the package holders (18) and the packages (12) is provided by a leaf spring (60) associated with each receiving nest (48) and by an openable and closable gate subassembly (20) associated with each pair of rows of receiving nests (48). The gate subassemblies (20) include gate bars (68) having anchor elements (100) adapted to engage the chip packages (12) when the gate is closed. The primary expected usage of the pallet assembly (10) is in wave soldering operations on chip packages (12) of various configurations.

REFERENCES:
patent: 725464 (1903-04-01), Lutz
patent: 971389 (1910-09-01), Malone
patent: 2706232 (1955-04-01), Pilas
patent: 4700935 (1987-10-01), Winslow et al.
patent: 4747532 (1988-05-01), Sim
patent: 4787550 (1988-11-01), Masuda et al.

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