Non-cyanide electroless gold plating solution and process...

Details Non-cyanide electroless gold plating solution and process... Non-cyanide electroless gold plating solution and process...

2007-09-04

2007-09-04

Klemanski, Helene (Department: 1755)

Coating processes

Immersion or partial immersion

Chemical compound reducing agent utilized

C106S001230, C106S001260, C427S305000, C427S438000

Reexamination Certificate

active

11226132

ABSTRACT:
The present invention provides a non-cyanide electroless gold plating solution free from a cyanide compound, comprising, as a completing agent of gold, a compound represented by the formula shown below or a salt thereof:in-line-formulae description="In-line Formulae" end="lead"?X—(CH2)n—SHin-line-formulae description="In-line Formulae" end="tail"?wherein n is 2 or 3 and X is SO3H or NH2, and having a pH value of 7 or less. The invention also provides a process for electroless gold plating using the non-cyanide electroless gold plating solution.

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Abstract of JP2003-342742, Dec. 2003.
Abstract of JP10-317157, Dec. 1998.
English translation of JP 2003/342742, Dec. 2003.
Hyomen Gijutsu (Surface Finishing), vol. 52, No. 5, 2001 (pp. 410-413). (Discussed on p. 3 of specification.), no month available.
Hyomen Gijutsu (Surface Finishing), vol. 46, No. 9, 1995 (pp. 775-777). (Discussed on pp. 3-4 of specification.), no month available.

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