Non-cyanide copper-zinc electroplating bath, method of surface t

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Forming multiple superposed electrolytic coatings

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205177, 205178, 205182, 205194, 205240, 205244, 106126, 106129, C25D 510, C25D 512, C25D 358, C23C 2800

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active

055341284

ABSTRACT:
A copper foil for a printed wiring board which has a carbon-containing copper-zinc coating comprising 40 to 90 atomic % of copper, 5 to 50 atomic % of zinc and 0.1 to 20 atomic % of carbon is produced by dipping a copper foil in a non-cyanide copper-zinc electroplating bath containing a copper salt, a zinc salt, a hydroxycarboxylic acid or a salt thereof, an aliphatic dicarboxylic acid or a salt thereof and a thiocyanic acid or a salt thereof, and carrying out electrolysis in the non-cyanide copper-zinc electroplating bath using the copper foil as a cathode to form on at least one surface of the copper foil a carbon-containing copper-zinc coating.

REFERENCES:
patent: 4356067 (1982-10-01), McCoy
patent: 4417956 (1983-11-01), McCoy
patent: 4537837 (1985-08-01), Gunn et al.
patent: 5356528 (1994-10-01), Fukuda et al.
Brenner, "Electrodeposition of Brass from Noncyanide Plating Baths", Electrodeposition of Alloys, vol. I (no month, 1963), pp. 457-465.

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