Non-cyanide brass plating bath and a method of making metallic f

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly alloy coating

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205155, 205244, 106 118, 106 123, 106 126, 106 129, C25D 358, C25D 356, B05B 310, B22F 700

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057627789

ABSTRACT:
The present invention provides a non-cyanide brass plating bath composition containing copper, zinc, metal polyphosphate, and orthophosphate, with the proviso that the composition does not contain cyanide. The present invention also provides a method of making metallic foil having a brass layer including the steps of providing a metallic foil; contacting the metallic foil with a non-cyanide brass plating bath containing copper, zinc, metal polyphosphate, and orthophosphate, with the proviso that the brass plating bath does not contain cyanide; applying a current to the brass plating bath; and recovering the metallic foil having a brass layer.

REFERENCES:
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patent: 3857681 (1974-12-01), Yates et al.
patent: 4010005 (1977-03-01), Morisaki et al.
patent: 4049481 (1977-09-01), Morisaki
patent: 4376154 (1983-03-01), Nakatsugawa
patent: 4456508 (1984-06-01), Torday et al.
patent: 4469567 (1984-09-01), Torday et al.
patent: 5243320 (1993-09-01), Clouser et al.
European Search Report mailed Jun. 24, 1997.
Abstract No. 127871X from Gerasimov, "Cyanide-free Brass Electroplating Prior To Rubberizing", Chemical Abstracts, vol. 80, No. 16, pp. 51-54 (Apr. 20, 1987).
Abstract No. 62272 from "Electrodeposition Of A Copper Zinc Alloy", Chemical Abstracts, vol. 72, No. 12 (Mar. 23, 1970).
Abstract No. 12947V from Derwent Publications Ltd., Week 7407 (Aug. 21, 1973).

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