Non-curing silicone pressure sensitive adhesives

Details Non-curing silicone pressure sensitive adhesives Non-curing silicone pressure sensitive adhesives

1977-04-21

1978-09-26

Lieberman, Allan

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

C-metal

260827, C08L 4304, C08L 8310

Patent

active

041170288

ABSTRACT:
Pressure sensitive adhesives which require no cure to develop maximum adhesive properties are obtained from mixtures of (1) from 30 to 70 weight percent of block copolymers of A styrenic monomers and B polydimethylsiloxane in which the styrenic blocks account for from 5 to 25 percent by weight of the total weight of the block copolymer and (2) from 30 to 70 percent by weight based on the total weight of (1) and (2) of a copolymer of Mw.sub.3 SiO.sub..5 and SiO.sub.2 units in which the mol ratio of Me.sub.3 SiO.sub..5 to SiO.sub.2 is from 0.6:1 to 0.9:1. A typical example of (1) is a block copolymer of styrene and dimethylpolysiloxane.

REFERENCES:
patent: 3528940 (1970-09-01), Modic
patent: 3576904 (1971-04-01), Saam et al.

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