Non-coplanar high-speed interconnects

Details Non-coplanar high-speed interconnects Non-coplanar high-speed interconnects

2008-10-09

2010-12-28

Jones, Stephen E (Department: 2817)

Wave transmission lines and networks

Long line elements and components

Connectors and interconnections

C333S033000

Reexamination Certificate

active

07859367

ABSTRACT:
In one example embodiment, a high-speed package includes first and second layers and a multi-channel non-coplanar interconnect. The first layer includes first and second sets of coplanar transmission lines. The second layer includes third and fourth sets of coplanar transmission lines. The multi-channel non-coplanar interconnect includes first and second channels. The first channel connects the first set of transmission lines to the third set of transmission lines. The second channel connects the second set of transmission lines to the fourth set of transmission lines.

REFERENCES:
patent: 5561405 (1996-10-01), Hoffmeister et al.
patent: 5675302 (1997-10-01), Howard et al.
patent: 6062872 (2000-05-01), Strange et al.
patent: 6407652 (2002-06-01), Kan
patent: 6599031 (2003-07-01), Li
patent: 6614325 (2003-09-01), Kocin
patent: 6876836 (2005-04-01), Lin et al.
patent: 6949992 (2005-09-01), Sweeney et al.
patent: 7076123 (2006-07-01), Kirkpatrick et al.
patent: 2003/0179055 (2003-09-01), Sweeney et al.
patent: 2003/0222282 (2003-12-01), Fjelstad et al.
patent: 2005/0224946 (2005-10-01), Dutta
patent: 2005/0237137 (2005-10-01), Dutta
patent: 2005/0239418 (2005-10-01), Koh et al.
patent: 2006/0028305 (2006-02-01), Dutta et al.
patent: 10-2005-0030022 (2005-03-01), None

Affiliated with

Also associated with

Rating

Non-coplanar high-speed interconnects does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Non-coplanar high-speed interconnects, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Non-coplanar high-speed interconnects will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4184831