Non-contaminating wafer polishing slurry

Details Non-contaminating wafer polishing slurry Non-contaminating wafer polishing slurry

1991-04-24

1992-08-18

Dixon, Jr., William R.

Compositions: coating or plastic

Coating or plastic compositions

Polishes

51293, 51308, 501 96, C09G 100

Patent

active

051395711

ABSTRACT:
A semiconductor wafer polishing slurry that does not contaminate a wafer processing area utilizes an aqueous organic base to suspend the slurry's fine abrasive particles. The organic base has large cations (13,16,19) that do not diffuse into semiconductor wafers. Therefore ionic contamination from the polishing slurry is substantially eliminated.

REFERENCES:
patent: 3807979 (1974-04-01), Cromwell
patent: 4022625 (1977-05-01), Shelton
patent: 4057939 (1977-11-01), Basi
patent: 4462188 (1984-07-01), Payne

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