Non-contacting technique for electroplating X-ray lithography

Details Non-contacting technique for electroplating X-ray lithography Non-contacting technique for electroplating X-ray lithography

1980-05-07

1981-11-24

Tufariello, T. M.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204297W, C25D 1706, C25D 1712

Patent

active

043023169

ABSTRACT:
An apparatus and method for coating a substrate. An electrically conductive substrate is placed in an electrolytic bath with the surface to be coated facing the anode. The cathode is placed near but not touching the other side of the substrate and an electric potential is applied to both electrodes. Means are provided to prevent electroplating of the cathode.

REFERENCES:
patent: 4042480 (1977-08-01), Noz
patent: 4043894 (1977-08-01), Gibbs
IEEE Transactions on Magnetics, MAG-10, (1974), pp. 828-831.

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