Non contact substrate chuck

Chucks or sockets – Vacuum

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C269S021000, C451S289000

Reexamination Certificate

active

07992877

ABSTRACT:
A chuck for releasably retaining a substrate, where the chuck has a body with a substrate receiving surface disposed in an X-Y coordinate plane and adapted to receive the substrate. The body has gas pressure delivery channels and gas vacuum drawing channels, where the gas pressure delivery channels and gas vacuum drawing channels are mutually exclusive within the body. The substrate receiving surface has gas pressure delivery portions in communication with the gas pressure delivery channels, for delivering a gas pressure against the substrate while the substrate is retained by the chuck, and thereby keeping the substrate from contacting the substrate receiving surface. The substrate receiving surface also has gas vacuum drawing portions in communication with the gas vacuum drawing channels, for drawing a gas vacuum against the substrate while the substrate is retained by the chuck, and thereby retaining the substrate proximate the substrate receiving surface. Retaining means retain the substrate in X-Y directions from sliding off of the substrate receiving surface.

REFERENCES:
patent: 5180000 (1993-01-01), Wagner et al.
patent: 5830277 (1998-11-01), Johnsgard et al.
patent: 6241825 (2001-06-01), Wytman
patent: 6375176 (2002-04-01), Getchel et al.
patent: 6672576 (2004-01-01), Walker
patent: 7091443 (2006-08-01), Watanabe et al.
patent: 7189313 (2007-03-01), Lubomirsky
patent: 7397648 (2008-07-01), Otaka et al.
patent: 7517431 (2009-04-01), Choi et al.
patent: 7603028 (2009-10-01), Yassour et al.
patent: 7643130 (2010-01-01), Yoshitake et al.
patent: 7665717 (2010-02-01), Lenzini
patent: 7728256 (2010-06-01), Jung et al.
patent: 2002/0000198 (2002-01-01), Ishikawa et al.
patent: 2005/0000949 (2005-01-01), Watanabe et al.
patent: 2006/0112880 (2006-06-01), Iwabuchi et al.
patent: 2008/0145190 (2008-06-01), Yassour et al.
patent: 10-2004-0073087 (2004-08-01), None
patent: 2005086588 (2005-09-01), None
patent: WO 2005086588 (2005-09-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Non contact substrate chuck does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Non contact substrate chuck, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Non contact substrate chuck will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2729694

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.