Non-contact sensing and controlling of spacing between a deposit

Details Non-contact sensing and controlling of spacing between a deposit Non-contact sensing and controlling of spacing between a deposit

1987-04-28

1988-08-09

Simmons, David

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29740, 118712, 156350, 156356, 356 4, 356375, G01B 1500

Patent

active

047625783

ABSTRACT:
The invention involves non-contact sensing of a selected location on a substrate at which material is to be deposited, and positioning of a material depositing tip a preferred distance from this location on the substrate according to such sensing and in preparation for the depositing. Preferably, the tip is advanced to a preferred spacing between it and the substrate, without overshooting the spacing and without contacting the substrate, in preparation for depositing.

REFERENCES:
patent: 3143041 (1964-08-01), Namenyi-Katz
patent: 3809308 (1974-05-01), Roeder et al.
patent: 4485387 (1984-11-01), Drumheller
patent: 4661368 (1987-04-01), Rohde et al.

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