Non-contact polishing

Details Non-contact polishing Non-contact polishing

1986-01-15

1991-08-20

Rose, Robert A.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

51283R, 51277, 51317, B24B 3106

Patent

active

050403362

ABSTRACT:
A non-contact polishing apparatus is used for polishing semiconductor planar substances. The substrate is set back from any surface and is held by a chuck fixed within a collar. This substrate holder assembly is placed within an enclosed container that has a non-abrasive solution therein. The container is mounted to a high speed nutating table that provides random motion to the holder assembly. This action provides isotropic polishing with no polishing created defects on the substrate surface.

REFERENCES:
patent: 1963563 (1934-06-01), Slepicka
patent: 2591083 (1952-04-01), Maier
patent: 3061422 (1962-10-01), Sato
patent: 3523834 (1970-08-01), Hewins
patent: 3813816 (1974-06-01), Funk
patent: 4270316 (1981-06-01), Kramer et al.
patent: 4519168 (1985-05-01), Cesna
Swain, M. V. et al., "Further Studies on Environment-Sensitive Hardness and Machinability of Al.sub.2 O.sub.3, " Journal of The American Ceramic Society, vol. 58, No. 9-10, 1975, pp. 372-376.
Brinton, J. B.; "Spinning Etchant Polishes Flat, Fast", Electronics; vol. 55, No. 1, Jan. 13, 1982.

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