Non-contact lead design and package

Details Non-contact lead design and package Non-contact lead design and package

1991-04-12

1992-08-25

Picard, Leo P.

Electricity: electrical systems and devices

Miscellaneous

361388, 361404, 361405, 29827, 437220, 437222, H05K 502

Patent

active

051424509

ABSTRACT:
A leadframe having wire bonding zones recessed from the single plane of the upper surface. Heat actuated adhesive tape sandwiched between the leadframe and a heatspreader is heated and the assembly is pressed together to bond the heatspreader to the leadframe without contacting the wire bonding zones.

REFERENCES:
patent: 4771330 (1988-09-01), Long
patent: 4807018 (1989-02-01), Cellai

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