Non-contact I/O signal transmission in integrated circuit packag

Details Non-contact I/O signal transmission in integrated circuit packag Non-contact I/O signal transmission in integrated circuit packag

1986-02-07

1989-08-29

Edlow, Martin H.

Coherent light generators

Particular component circuitry

Optical pumping

357 74, 357 30, 350 9611, 372 50, H01L 3112, H01L 2302, H01L 2714, G02B 612

Patent

active

048622311

ABSTRACT:
The I/O ports of a packaged IC includes a plurality of optical conduits in the package adjacent electro-optical transmitters and receivers throughout the die spaced from the periphery of the die. The method of assembling the die in the package includes using optical transmitters on the die to align the top of the package and the optical conduits to the die which was previously mounted in the base of the package.

REFERENCES:
patent: 4207583 (1980-06-01), Temple
patent: 4249193 (1981-02-01), Balyoz et al.
patent: 4274104 (1981-06-01), Fang et al.
patent: 4533833 (1985-08-01), Copeland et al.
Crow et al., "Gallium Arsenide Laser--Array--on--Silicon Package", Applied Optics, vol. 17, No. 3, Feb. 1, 1978, pp. 479-485.

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