Non-contact I/O signal pad scan testing of VLSI circuits

Electricity: measuring and testing – Plural – automatically sequential tests

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

371 251, G01R 3128

Patent

active

048750034

ABSTRACT:
In a microcircuit employing LSSD boundary scanning, input and output cells of the circuit are tested using the LSSD boundary scan circuity. Input cells of the circuit are tested by applying two voltages alternately to input cell signal pads and capturing and shifting out through input boundary scan circuitry the responses of the input cells to the voltages. Output cells are tested by shifting a predetermined test pattern through the output boundary scan circuitry. The pattern encloses a set of significant bits which is applied sequentially to the output cells. Each output cell has a gated signal path connecting its signal pad to an internal signal conductor which conducts the response of the output cell to an internal signal path as the significant bits of the bit pattern are scanned past the cell.

REFERENCES:
patent: 4791358 (1988-12-01), Sauerwalp et al.
IEEE article reprinted from the Proceedings of the Fourtheenth Design Automation Conference, 1977, pp. 462-468, copyright 1977 by IEEE.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Non-contact I/O signal pad scan testing of VLSI circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Non-contact I/O signal pad scan testing of VLSI circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Non-contact I/O signal pad scan testing of VLSI circuits will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1745453

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.