Non-contact holder for wafer-like articles

Handling: hand and hoist-line implements – Utilizing fluid pressure – By positive fluid stream directed against article

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Details

294 641, B25J 1506

Patent

active

060990562

DESCRIPTION:

BRIEF SUMMARY
BACKGROUND

1. Field of the Invention
The present invention relates to a holder for holding wafer-like articles without physical contact between the holder and the wafer-like article being held. More particularly, the present invention relates to an apparatus for holding articles through the use of a particular fluid dynamic relationship between the wafer-like article and the holder created by the structure of the holder.
2. Description of the Prior Art
The handling of wafer-like articles, such as silicon wafers, can present problems. Some prior art wafer-like article holding, apparatus have mechanical latches to hold the article in place. The mechanical latches have drawbacks such as contact between the article and the holder. The contact can cause contamination of the article as well as induce mechanical stresses in the article.
Other prior art wafer-like article holders include vacuum or electrostatic chucks. These types of holders also have drawbacks. Such drawbacks include physical contact between the holder and the article which can cause contamination and mechanical damage. Also, because some actual pre-processed articles, such as wafers, are not flat, securing such articles on a flat holder by vacuum or electrostatic means can cause mechanical stresses in the article.
U.S. Pat. No. 5,080,549 discloses a wafer handling apparatus operating under the Bernoulli principle to pick up, transport and deposit wafers. The apparatus includes a plate that has a plurality of laterally oriented outlets and a central outlet for discharging gas in a pattern sufficient to develop a low pressure environment to pick up the wafer while bathing the wafer in radially outflowing gasses to prevent intrusion and deposition of the wafer of particulate matter in suspension. The pressure differential caused by the Bernoulli principal serves to lift the wafer without any physical contact whatsoever between a wand assembly and the top or bottom surfaces of the wafer.


SUMMARY OF THE INVENTION

The present invention provides a holder for holding wafer-like articles without physical contact between the holder and the wafer-like article being held. The holder comprises a platform having an article facing surface which includes at least one annular groove therein formed by an inner wall, an outer wall and a ceiling surface between the inner and outer walls. The ceiling surface is provided with an opening. The holder further includes a gas conducting conduit which is connected to the opening in the ceiling surface of the annular groove. The gas conducting conduit is oriented relative to the opening in the ceiling surface of the annular groove so as to cause a circular flow of gas around the annular groove when a gas is flowed down the conduit and through the opening.
One object of the present invention is to provide a wafer-like article holder that avoids physical contact between the wafer-like article and the holder.
Another object of the present invention is to provide a wafer-like article holder that does not induce mechanical stress in the wafer-like article while it is being held.
The foregoing and other objects, features, and advantages will become apparent from the detailed description of the preferred embodiments invention as illustrated in the accompanying drawings.


BRIEF DESCRIPTION OF THE DRAWINGS

The drawings, which are not drawn to scale, include:
FIG. 1A, which is a diagram plan view of one embodiment of the apparatus of the present invention;
FIG. 1B, which is a diagram plan view of an alternative embodiment of the apparatus of the present invention;
FIG. 2A, which is a sectional view of the embodiment illustrated in FIG. 1A taken along the line 2A--2A, and which also includes a wafer-like article adjacent to the apparatus;
FIG. 2B, which is a sectional view of the embodiment illustrated in FIG. 1A taken along the line 2B--2B, and which also includes a wafer-like article adjacent to the apparatus;
FIG. 3, which is a graph showing the relationship of the differential pressure with radial distance from the center of

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IBM Technical Disclosure Bulletin; vol. 19, No. 4; Sep. 1976, "Beveled Bernoulli Head" by Cunningham et al.
IBM Technical Disclosure Bulletin; vol. 22, No. 5; Oct. 1979 "Diverted Flow Bernoulli Pick-Up Device" by Balder et al.

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