Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Patent
1998-06-18
2000-11-14
Ryan, Patrick
Metal fusion bonding
Including means to apply flux or filler to work or applicator
By partial or total immersion of work or applicator into liquid
228 21, 2281801, 228 37, 118406, B23K 108, B05C 302
Patent
active
061457299
ABSTRACT:
A wave solder pallet having a first side that is adapted to receive a printed circuit board and a plurality of through holes or apertures that will allow solder to be transmitted through to selected regions on the printed circuit board. The surface of the base plate that is positioned adjacent the solder wave has channels formed therein, the channels being tapered inwardly so that the overall volume of the channel is greatest at the periphery of the pallet. The increased volume of the channel reduces the pressure effect of the solder wave as it contacts the pallet at the periphery thereby reducing the amount of solder that is splashed over the pallet. The tapering of the channel uniformly increases the pressure so that the pressure effect of the solder wave is increased when it travels through the apertures. Moreover, at a location adjacent the through holes, the surface of the pallet is closer to the solder wave than at some other locations, so as to increase the pressure effect of the solder wave within the adjacent aperture.
REFERENCES:
patent: 5121869 (1992-06-01), Knudsen, et al.
patent: 5454505 (1995-10-01), Kearns
patent: 5617990 (1997-04-01), Thompson, Sr.
Cook Colben P.
MCMS Inc.
Ryan Patrick
LandOfFree
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