Non-conductive substrate for a printed circuit and method of man

Details Non-conductive substrate for a printed circuit and method of man Non-conductive substrate for a printed circuit and method of man

1979-12-10

1981-07-28

McCamish, Marion

Stock material or miscellaneous articles

Structurally defined web or sheet

Including aperture

260 37M, 260 4215, 428156, 428209, 428327, 428328, 428331, 428404, 428405, 428407, 428901, C08K 906

Patent

active

042810388

ABSTRACT:
The disclosure is of a substrate or supporting board for supporting printed ircuits and the method of its manufacture. The boards of the invention are preferably made of a high-temperature resistant thermoplastic, sensitized to receive a printed circuit element by the dispersion of coated iron or copper particles in the thermoplastic matrix. The coating is a bonding assistant.

REFERENCES:
patent: 2739881 (1956-03-01), Kepple
patent: 3031344 (1962-04-01), Sher
patent: 3672986 (1972-06-01), Schneble
patent: 3799802 (1974-03-01), Schneble
patent: 3910852 (1975-10-01), Lederman

Affiliated with

Also associated with

Rating

Non-conductive substrate for a printed circuit and method of man does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Non-conductive substrate for a printed circuit and method of man, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Non-conductive substrate for a printed circuit and method of man will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-549223